NXP Manuals

This is a PDF file containing the package dimension information of SOT630-2, including P, SL, SP, SR, etc.

File format: PDF Size:11 KB

This document describes the PCB board footprint for reflow soldering of the HSOP16F package produced by NXP B.V. in 2008. The document provides the dimensions and solder pad layout of the package.

File format: PDF Size:13 KB

This document provides information on the dimensions and soldering details of the NXP Semiconductors PC board footprint SOT815-1. It includes the footprint information for reflow soldering of the DHVQFN24 package.

File format: PDF Size:19 KB

This document provides PC board footprint dimensions for NXP B.V. 2008. It includes solder land and solder paste dimensions for the LFBGA296 package, as well as a generic footprint pattern for reflow soldering. The document provides important information on product dimensions and soldering methods for users.

File format: PDF Size:11 KB

SOT762-1 PC board footprint for reflow soldering of DHVQFN14 package

File format: PDF Size:19 KB

This is a PDF file about the PCB footprint of SOT426 chip, including the chip's solder pads, solder paste, solder pads, etc.

File format: PDF Size:13 KB

This is a Nxp pc board footprint file, which describes the SOT903-1 package pcb dimensions

File format: PDF Size:23 KB

This document discusses factors that need consideration when an I2C-bus is used to communicate between two points that do not share a common logic ground potential. I2C logic signals are referenced to a ground level and it is expected that connected devices share that reference. In practice, when an I2C-bus is extended to link devices that are separated by distances exceeding about 1 meter there can be many factors that cause differences in the local ground potential of those devices and that in turn affects the noise margins of the system and can lead to device ratings being exceeded. In other cases, where an I2C-bus could provide an attractive data link there is no possibility for a shared ground reference. Examples include the need to provide safety isolation between the I2C control signals and AC mains power, telephone lines, or patient monitoring medical equipment. In other cases, such as Power over Ethernet, standards require isolation of the grounds. Solutions are provided to deal with ground differences ranging from less than 1 V up to kilovolt levels by using Opto or transformer isolators in the signal path. Key to all solutions is the availability of I2C isolation devices.

File format: PDF Size:398 KB

NXP Voltage Translators (NVT) are used in bidirectional signaling voltage level translation applications for I/O buses with incompatible logic levels. The NVT2001 and NVT2002 are single- and dual-channel voltage translators, operational from 1.0 V to 3.6 V at VCC(A) (low voltage side) and 1.8 V to 5.5 V at VCC(B) (high voltage side) without direction control for open-drain or push-pull I/O devices.

File format: PDF Size:329 KB

This is a footprint for SOT143R package

File format: PDF Size:8 KB

The OM11055 is a PCF8883 evaluation board which can be used to demonstrate and evaluate the PCF8883 capacitive proximity switch. The PCB is designed to make it easy to adjust the switch’s sensitivity. The board can be powered using a Mini USB cable or a 9V battery.

File format: PDF Size:280 KB

This document introduces the NXP CATV C-family products, including BGY588C, BGE788C, and CGY888C push-pull amplifiers, BGD712C, CGD944C, and CGD942C power doublers, and BGO807C optical receiver. These products are compliant with the Chinese State Administration for Radio, Film and Television (SARFT) standard and provide excellent linearity, stability, and reliability for cable TV networks in China.

File format: PDF Size:284 KB

NXP's payment solutions offer financial institutions, card manufacturers and consumers a variety of secure, reliable and attractive solutions.

File format: PDF Size:96 KB

NXP Semiconductors' 3rd generation, fully integrated silicon tuner TDA18252HN helps create high-performance, low-cost digital cable set-top box solutions for all markets, while still requiring analog loop-through capabilities for major markets like India and China.

File format: PDF Size:1101 KB

File format: PDF Size:0 KB

MicroPak and MicroPak II packages are the world's smallest packages for single-, dual-, and triple-gate logic. They are 65% - 74% smaller than their PicoGate equivalents and offer a larger pad size that provides a more rugged and reliable bond between the device and the PC board.

File format: PDF Size:350 KB

The NXP ARM7 series microcontrollers integrate an LCD controller, with powerful performance and a wide range of applications in consumer, entertainment, industrial/commercial, medical and automotive applications.

File format: PDF Size:175 KB

ICODE SLI-S is a smart label IC from NXP company that supports ISO 15693, ISO 18000 and HF EPCglobal/Auto ID standards. It offers password-protected memory access that can be tailored to meet your specific needs. In addition, the ICODE SLI-S features increased user memory. So you can use 32-bit or 64-bit passwords for even higher security in your applications.

File format: PDF Size:103 KB

The TEA1522 is a low-power switched-mode power supply (SMPS) controller IC from NXP. It features high efficiency, low standby power (< 100 mW), low EMI, and small footprint. The chip can be used for USB chargers, small power supplies, white goods, small personal care equipment, portable equipment chargers, coffee machines, security cameras, and general household appliances.

File format: PDF Size:148 KB

NXP's ADC1415Sxxx is a single-channel 14-bit ADC that supports up to 125 MSPS sampling rates and features excellent dynamic performance, along with a low-power BiCMOS input buffer for use in high-IF applications.

File format: PDF Size:159 KB