NXP Manuals

This document describes how to use the demonstration board DEMO8766G for the analog-to-digital converter ADC1002S020. The features of the demo board include a 2Vpp input signal range, a single TTL-CMOS clock signal, and a 3.3V power supply.

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JEDEC JESD204B is the third revision of the JESD204 high-speed serial digital interface specification for data converters and logic devices. This specification supports multiple data lanes and lane synchronization, making it suitable for use in modern 3G, 3G+ and 4G broadband wireless communications.

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SOT1078-1_fr is a PDF file published by NXP B.V. 2008, which contains the PCB layout information of SOT1078-1

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This document is about SOT1063-1 PCB footprint information

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This is a document about the PCB foot print dimension of SOT999-1.

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This document is a datasheet published by NXP Semiconductors about the PCB footprint dimensions and soldering information of the SOT994-1.

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This document provides information about the PC board footprint dimensions for NXP Semiconductors. It includes details about the solder land dimensions, solder paste occupied area, and the footprint pattern for reflow soldering of the LFBGA487 package.

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This document provides information about the PC board footprint dimensions of the SOT1088-1 package from NXP B.V. 2008. It includes details about solder land dimensions, solder paste occupied area, etc.

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This document is the description document of NXP Semiconductors PC board footprint Footprint for reflow soldering of HVSON14 package SOT1054-1.

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The document provides information about the PCB board dimensions for NXP Semiconductors. It includes the dimensions of the solder land and solder paste area for the LFBGA516 package, as well as a generic footprint pattern for reflow soldering.

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This is a SOT913-1 PCB footprint drawing.

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This is a PDF file. The file contains the PCB footprint dimensions information of the SOT1024-2 product.

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This document is the printed circuit board footprint dimensions information for SOT911-1 chip.

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This is a footprint information for SOT728-2

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This document is a PDF file of PCB footprint information for the electronic component SOT836-1. The document includes dimensions of the PCB board, solder lands, solder paste, and solder resist.

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This document is about the PC board footprint for reflow soldering of NXP Semiconductors XQFN8 package. The document provides dimensions and layout of the footprint, as well as the clearance placement and occupied area solder lands for soldering process.

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This document provides the PCB footprint information for SOT962-3, including dimensions, solder pads position etc.

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This document provides information about the PC board footprint dimensions of the NXP SOT1085-1 package. It describes the dimensions of the solder land and solder paste deposit, as well as the generic footprint pattern for reflow soldering.

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This document provides information about the dimensions of the NXP B.V. PC board footprint SOT841-4 package, as well as the solder land information for reflow soldering.

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